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Rad-hard Microcontroller with Open Access ISA for Space Applications H2020 Programme Space Theme Absint

Milos Krstic, Felipe Kuentzer, Klaus Tittlebach, Cristiano Calligaro, Umberto Gatti, ThalesAlerfia Juan Cueto, Fatima García Donday, Michael Schmidt, Bernhard Schommer, Christian Ferdinand, Axel von Blomberg SYSGO EMBEDDING INNOVATIONS

June 3rd, 2022 9th International Workshop on Analogue and Mixed-Signal Integrated Circuits for Space Applications -

Agenda        M     RAL     =

 Background
 MORAL Project Introduction
 MORAL Microcontroller
  PEAKTOP Architecture
  Specification
  Digital Design
  Technology and PDK
  Memory and Analog IPs
  Evaluation Board
 MORAL Software
  PEAKTOP Toolchain
  Compiler and RTSK
 Development Status

Ie L AMICSA‘22 Workshop June 3, 2022 2

                                                                =
                                                                      MORAL

Background =

Small satellites – 2030 and beyond  Low-cost small satellites (from 10 kg to 500 kg)  Potential for scientific research and practical applications

 Small satellite modern applications  Satellite swarms or constellations replacing large satellites  Augmented satellite based navigation systems  Satellites in commercial aviation  Commercial satellite imagery based services  Robotic servicing technologies for space applications

 5

 Mainly powered by traditional electronics Ne  Increased capabilities, but reduced reliability ER 57,000 satellites planned through 2029

L AMICSA‘22 Workshop June 3, 2022 3

                                                                             =

Introduction =

MORAL Project – H2020 Space Theme Programme  Duration from 01. January 2020 to 30. April 2023 (40 months)  Funded by the EC - GA No. 870365  Two main objectives  Develop a completely European, ITAR-free microcontroller for space applications  Exploitation plan for entering the market  5 partners

                         Microcontroller
                         design and test

Specification and po] Evaluation (RTOS development & Compiler) Exploitation

L AMICSA‘22 Workshop June 3, 2022 4

Introduction =

MORAL in a nutshell  Microcontroller based on the novel PEAKTOP architecture, including a novel Instruction Set Architecture (ISA)

 Formally-verified C compiler, RTOS, and toolchain

 Demonstrator board

 Irradiation tests

 Aggressive exploitation plan for bringing the product into market

L AMICSA‘22 Workshop June 3, 2022 5

MORAL Microcontroller - PEAKTOP M RAL =

Why a new processor core architecture?  IHP’s PEAKTOP architecture  Freely available  Complete control over each aspect of the microcontroller  ITAR-free  Scalable (e.g., to 64-bit)  More than TMR and ECC features

 PEAKTOP provides mixed criticality support  Multiple functions with different criticalities and assurance levels to co-exist in the microcontroller architecture  General Purpose Register (GPR) banks can be dynamically grouped  Dual-, Triple- or Quadruple-Modular Redundant (DMR/TMR/QMR) module to increase the fault tolerance

AMICSA‘22 Workshop June 3, 2022 6

PEAKTOP Architecture M RAL =

 IHP’s own processor  Open ISA PEAKTOP Bootrom execution pipeline  Core architecture characteristics SRAM  RISC architecture System  Up to 64 GPR  IEEE 754 compliant Floating Point Unit (FPU) endl [bd  Optional Digital Signal Processing (DSP) extension  New ISA is fully orthogonal, regular, and circular  Multiprocessing support (cache coherence, synchronization support, atomic transfers)  Configurable addressing space: up to 64-bit; virtual address space is up to 128-bits  32-bit wide instructions up to 3 operands  2-level Memory Protection Unit (MPU), or (optionally) 2-level Memory Management Unit (MMU)  Optional L1 (separate data/instruction) cache, and L2 cache

L AMICSA‘22 Workshop June 3, 2022 7

M

MORAL Microcontroller – Specification

                                      PROM
                          Memory     FLASH
PEAKTOP CORE              controller  SRAM
 PEAKTOP      CHAM  Ss               SDRAM

execution pipeline ADC, DAC with FPU and DSP x

    7     § || cess,
 Interrupt  Debug User    2  ==
controller  unit timer        12C, SpaceWire

Microcontroller    ny        K
    Na
System-on-Chip     brid       ali


L AMICSA‘22 Workshop         June 3, 2022  8

MORAL Microcontroller – Specification M RAL =

 256/512 Kbyte SRAM  Error Detection and Correction (EDAC) protection unit

                                                                                 PROM

 1 x Interrupt Controller PEAKTOP CORE Memory controller SRAM  32 interrupt lines PEAKTOP 5 SDRAM execution pipeline =a  6 x Timers Interrupt Debug User H PEE  2x system + 4x user timers controller] fini] 5 Microcontroller reer |  64 x GPIO ports “Watchdog. |  Shared with internal peripherals I/Os

L AMICSA‘22 Workshop June 3, 2022 9

MORAL Microcontroller – Specification M RAL =

 Peripherals PROM, FLASH, SRAM, SDRAM  1 x 8-channel 12-bit ADC  2 x 12-bit DAC  2 x CAN 2.0 modules | Controller Timer Timer +EDAC +EDAC  4 x UART interfaces EE  2 x SPI interfaces APEPeripheral Bus  2 x SpaceWire interfaces (incl. RMAP protocol)  1 x MIL-STD 1553C bus interface (incl. redundant bus)  2 x I2C interfaces  1 x 8-channel PWM generator  4 x Pulse counters  1 x Watchdog timer

 Rad-Hard Specification  Total ionizing dose (TID) 100 krad (Si)  Single event upset (SEU) for the processor’s digital core >30 MeVcm²/mg  Single event latch-up (SEL) >60 MeVcm²/mg L AMICSA‘22 Workshop June 3, 2022 10

MORAL Microcontroller – Digital Design M RAL =  Processor core design |r =|  PEAKTOP previously developed, implemented, and = H H | General H Special tested in IHP 130nm technology H  FPU design and redesigned of MPU to support the RTSK needs ALUPUoe JI TR via wl] Erp  Peripherals design an integration |) reer]| | | = ==  MIL-STD 1553C designed at IHP : REE  Peripheral in the specification integrated | hw Data transfer| i Control valid (SUM Copy):  Verification Moral testbench  Carried every step of the design, from RTL simulations RAM || ROM to post-synthesis, and in FPGA

                                                         Clock

                                                         Reset  —

L AMICSA‘22 Workshop MIL1553 ... CAN June 3, 2022 11

MORAL Microcontroller – Technology and PDK

Commercially available IHP Technologies – Multi Project Wafer (MPW)

Baseline CMOS technologies

 Dual-gate 0.13um CMOS


 SGB25V      SG25H3                                     $G13G2

npn-HBTs up to npn-HBTs up to npn-HBTs up to npn-HBTs up to f/f L7V | | £ ,, 1.65V Voce Up to 7V Upto 7V Vey | | =120/330GHz 2.5V SGB25RH variant Qualified

SG25H5-EPIC Stable/ ( 3 G135Cu || SG13G2Cu Early access LBE, TS | $6135 135 with || SG135 with Ge-PD, MZM, WG, GC... variant ||

                      Backside RDL

with Under W2W bonding Next generation SG13G3 Cu-BEOL development RadHard MOS devices L AMICSA‘22 Workshop June 3, 2022 12

MORAL Microcontroller – Technology and PDK                 M < >RAL     =

IHP SG13S/RH - PDK for Space Applications
                                                           SG13S/RH

                        Process Description                                              SiGe HBTs npn Peak fT /fMAX 220/340GHz
                                                                                               130nm Dual Gate –Oxide CMOS
                                                                                           (VDD=+1.2V, +3.3V ; TOX = 2nm / 7nm)

                        Commercial Qualification                                                     completed 2014
                        Based on JEDEC Standard JP001.01
                        EPPL/QML/QPL (ESCC QPL, ESCC QML, MIL QPL, JAXA QPL)                       Evaluation ongoing

                        PDK Av ailability                                                    In dev elopment -Early Access
                                                      Access Status        NDA/EXPORT License

                        CMOS Std Cell Core and IO Libraries                                    IHP IXC013RH (~ 90 cells)

                        Radiation Assessment (Digital)                                         100krad(Si) – 300krad(Si)
                                                      TID                                          SEU/SEL completed
                                                      CMOS Libraries
                                                                                               SEL Threshold > 65MeV/cm²/mg
                                                                                                     (RHBD IHP cells)

                                                           SEU Threshold     > 30MeV/cm²/mg
                                                                                                      (IHP RTMR FF)

                        Ev aluation Testing                                                        Activ ity started
                                                      in acc. ESCC No. 2269010

                        Operation Temperature (max rated TJ)                                     -55°C to +125°C (TBC)

                        Test Vehicles                                                                     TCV,
                                                      in acc. ESCC No. 2269010                DEC –I DEC-II(CMOS, Bipolar)
                                                                                                     RIC in progress

                        Radiation Tests                                                                completed
                                                      TCV (Devices, analog)                                „
                                                      DECs (Digital, Analog BiCMOS)        DEC-I (SEU/SEL), Early structures
                                                      RIC    (Mixed-Signal IC)                          planned

— |  Endurance Testing HT & RT Activ ity started HBT npn- devices (qualification of technology for general purpose applications done)  HBT lifetime determination  CMOS devices  CMOS Core & IO Std Cell Library

   AMICSA‘22 Workshop                                      June 3, 2022      13

MORAL Microcontroller – Memory and Analog IPs                                                                      M RAL =

 Rad-hard SRAMs                                                 Input Buffer   Input Buffer  Input Buffer    Input Buffer
 Independent decoding schemes                                    Row DEMUX      Row DEMUX      Row DEMUX      Row DEMUX
                                                                    Column         Column         Column         Column
                                                                    DEMUX          DEMUX          DEMUX          DEMUX
 6T SRAM cell                                                    Read/Write     Read/Write     Read/Write     Read/Write
                                                                Column Driver  Column Driver  Column Driver  Column Driver

   Island Guard Ring (IGR) instead of Enhanced Guard Ring (EGR)
   Tradeoff between inter-device leakage degradation and area    Equalizer | Equalizer | Equalizer     |      Equalizer
        DIN<0>     DOUT<0> DIN<1>                                                 DOUT<1> DIN<2> DOUT<2>    DIN<7> DOUT<7>










    64kbit


    32kbit



L AMICSA‘22 Workshop Single bit macro    Test Chip 1  June 3, 2022  14

Row Driver Bus

Matrix Bus Row Driver Bus

Matrix Bus Row Driver Bus

Matrix Bus

Row Driver Bus

Matrix Bus

MORAL Microcontroller – Memory and Analog IPs M RAL =

 Rad-hard 12-bit DAC  Architecture based on resistor divider (Kelvin divider)

=     he        Test Chips 2 and 4

JL = 73

 Rad-hard 12-bit ADC  Architecture - SAR (Successive Approximation Register)  Single-ended and differential ls 3 3

Test Chips 3 AMICSA‘22 Workshop June 3, 2022 15

MORAL Microcontroller – FPGA Board

 Implementation on programmable hardware platform  Early hardware debug  Early tests of complex software  Ex.: Operating system, compiler and assembler tool-chain, and simple applications

 Project dissemination  Opportunity for the academia to know and experiment with the new architecture

     For availability of an
     evaluation board use
    
!     the contact form in

_ www.moral-project.com = R MORAL’s website.

a L AMICSA‘22 Workshop FPGA board June 3, 2022 16

MORAL Software – PEAKTOP Toolchain M RAL =

 Open source toolchain  Multiprocessor Debugger  Instruction Set Simulator  Complete ISA and tools documentation

= [EH = Ee

|L AMICSA‘22 Workshop https://www.moral-project.eu/acad_open_source.html June 3, 2022 17

MORAL Software – Compiler and RTSK M RAL =

CompCert – 2021 ACM Software System Award  Compiler for C programming language

 The only formally verified compiler in the market  Free for evaluation, research, and education  Commercial licenses distributed by AbsInt

 Porting of CompCert for the PEAKTOP architecture  Implementation of binary utilities Bu |  Optimization and formal verification les |= —  Semi-automatic testing with FPGA board

L AMICSA‘22 Workshop June 3, 2022 18

MORAL Software – Compiler and RTSK M RAL =

 Real Time Separation Kernel - RTSK  Provides isolated partitions Partition Partition  Communication between partitions  Partition is an execution environment that  Serves as a virtual CPU Separation Kernel  Contains a guest operating system CPU  RTSK tailored for the PEAKTOP microcontroller  Microcontroller for space platforms provide limited RAM for any COTS  Must have a very low footprint

 Separation kernel prototype  First release for project partners  Running on the FPGA board

L AMICSA‘22 Workshop June 3, 2022 19

Development Status                                              =

MORAL Project        | Status | Period | Comments               |
Prototype specification                    done   Q2 2020   Completed
Prototype design                           done   Q1 2021   FPU, DSP support, and M1553
Prototype functional tests                 done   Q1 2021   Integration and functional simulations
Prototype emulation                        done   Q2 2021   Running on the FPGA board
Memory and analog IPs design               done   Q4 2021   SRAM, DAC, and ADC
Test chips fabrication                     done   Q4 2021   Four test chips
RTSK                                       done   Q4 2021   Running on the FPGA board
Compiler - CompCert                        done   Q1 2022   Porting and verification completed
SRAM, DAC, and ADC test chips evaluation   done   Q2 2022   12-bit DAC and 12-bit ADC
Drivers, library, and software tools              Q1 2023   Specification on-going
Prototype fabrication and testing                 Q2 2022   Layout on-going
Prototype stress tests                            Q1 2023   Radiation test PCB on-going
Prototype demonstrator                            Q1 2023   Demonstrator PCD on-going

I L AMICSA‘22 Workshop June 3, 2022 20

MORAL Website M<RAL =

 Access for more information and news about MORAL  Links for the project Social Media  PEAKTOP toolchain download

Export-free Rad-hard Microcontroller for Space Applications

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